01 · Measure · AutoMeasure
02 · Model · AutoPDK
03 · Verify · AutoCD
probe card · 16 needles
die (−4, 2)
measured silicon
model card · fitting
capacitor DAC · 2 × 128 units
comparator · mirror-symmetric
SAR logic
bootstrapped switch
metal 3 · top plates
metal 2 · bit lines
metal 1
poly · active
Plate 0 A 300 mm wafer, in ink and interference colour. Three of its dies carry the three products.

AutoFab · Autonomous semiconductor engineering

The autonomous fab.

From the first touchdown on test silicon, to the models every design depends on, to a verified circuit — three products on one data chain, and the loop closes every time the process moves.

01 · Measure AutoMeasure

Catch bad data while the wafer is still on the chuck.

Every curve checked against physics and its neighbours as it lands — a bad touchdown is caught, explained and re-measured on the spot.

die (−4, 2) · touchdown 0007sweeping
0 / 9 checks wafer map · 1 / 25
40–70%
less engineer time per measurement project, depending on complexity
Zero
changes to lab software · any vendor
Open AutoMeasure

02 · Model AutoPDK

Compact models, extracted autonomously.

Your extraction method, run as a plan: seven stages in physics order against real SPICE, every stage checked before it is accepted.

stage 1 / 7 · C–VRMS —
iteration 1
< 1 hour
raw wafer data to a finished BSIM4 card · internal benchmark
34+
compact models ready to run
Open AutoPDK

03 · Verify AutoCD

Spec in. Verified layout out.

An 8-bit SAR ADC — capacitor DACs, comparator, SAR logic — generated, laid out DRC- and LVS-clean, and re-simulated with its parasitics.

8-bit SAR ADC · architectureD = ––––––––
DRC 0LVS cleanparasitics27 corners converting
60%+
less designer time per chip · target
2 blocks
spec to verified layout on OpenPDK
Open AutoCD

AutoFab 04 · One wafer, one loop

Change. Measure. Model. Verify. Release.

Today that loop takes a quarter, three teams and three toolsets. With AutoFab it runs as one chain — in days, not a quarter.

measuredmodeledverified

01 The AutoFab products

Three products. One data chain.

Each stands on its own and fits the tools a fab already runs. Together they cover the life of a process, from the first measured wafer to production — and close the loop every time it moves.

die 01 · sweeping

01 · Measure

AutoMeasure

Autonomous measurement on the prober — an agentic layer on the lab you already run.

40–70%
less engineer time per measurement project, depending on complexity
Zero
changes to lab software
Early access · built with each fab Open AutoMeasure

stage 1 of 7 · fitting

02 · Model

AutoPDK

Compact-model extraction and PDK release — your method, run as a plan, every stage checked.

< 1 hour
raw wafer data to a BSIM4 card · internal benchmark
34+
compact models ready to run
Ready today Open AutoPDK

27 corners · re-verifying

03 · Verify

AutoCD

Autonomous circuit design — every corner, statistics, layout verified after extraction.

60%+
less designer time per chip · target
2 blocks
spec to verified layout on OpenPDK
In development Open AutoCD

The three panels above are live illustrations drawn in your browser, not recordings.

02 One data chain

Every change, followed through.

A node goes round this loop many times before v1.0 — and again after every tweak. Each turn used to cross three teams and three toolsets, with files passed between them. AutoFab runs it as one chain, with the evidence carried from step to step.

  1. 01

    Change

    A process tweak, a new lot, a new node. The loop starts here.

  2. 02

    Measure

    Characterized on the prober, every curve checked as it is measured and re-measured on the spot.

    AutoMeasure
  3. 03

    Model

    Compact models refitted in physics order, verified, and the PDK released.

    AutoPDK
  4. 04

    Verify

    The designs built on the PDK re-simulated at every corner; what slipped is flagged and re-tuned.

    AutoCD
  5. 05

    Release

    Signed off by the engineer, with the evidence of every step attached.

Today

three teams · three toolsets · files passed between them

a quarter

With AutoFab

days

03 What it gives back

  1. AutoMeasure 40–70% less engineer time per measurement project, depending on complexity — with zero changes to the lab software.
  2. AutoPDK < 1 hour from raw wafer data to a finished, verified BSIM4 card in an internal benchmark — 60–75% less engineer time per model.
  3. AutoCD 60%+ less designer time per chip, with minimal intervention — the target for the production release.

04 Honest status

One ready today. Two built with you.

AutoPDK · ready today

Autonomous extraction and PDK release, in the cloud or on your own hardware — the foundation the other two stand on.

AutoMeasure · early access

Built with each fab: co-developed on the fab's own instruments and data, on-premises. Not an off-the-shelf download.

AutoCD · in development

Proven end to end on two blocks on OpenPDK, with production-grade release targeted in the next 9–15 months.

The engineer sets the rules and signs off. AutoFab does the iteration.

→ autofab.ai

Bring us your slowest step.

Measurement, models or design — tell us where your data chain loses the most time, and we'll show you the AutoFab product that takes it back.

contact@autopdk.ai AutoMeasure · AutoPDK · AutoCD
Start at the beginning of the chain · 01 · Measure AutoMeasure Then AutoPDK, then AutoCD — the whole data chain, one product at a time.
die (7, 4)
probe card · 16 needles
chuck · 25.0 °C
storage
file share · unchecked
the chuck — empty
the wafer — in storage, maybe scrapped
Plate I A 300 mm characterization wafer under test. Probe card lowered, live.

AutoMeasure · Autonomous measurement for semiconductor labs and test floors

Catch bad data while the wafer is still on the chuck.

AutoMeasure is an agentic layer on top of the lab and test software you already run. Its agents check every curve the moment it lands — against device physics and against its neighboring devices — and re-measure on the spot. Clean, traceable data flows straight into modeling.

Agent · livetouchdown 0041
die (7, 4) · Id–Vg · Vd 50 mV · 25.0 °C
9 / 9 checks passed
  • 40–70%less engineer time per measurement project, depending on complexity
  • Zerochanges to your lab software, instruments or probers
  • Any vendorworks through the software you already run
  • On-premisesthe data never has to leave the fab

Today 01 · The measurement

A wafer of test structures goes on the chuck. Thousands of curves come off it.

Id–Vg, Id–Vd and C–V sweeps on every device, at each temperature in the plan. Nobody looks at most of them as they land. Nobody has time to.

Today 02 · The hand-off

The curves go to a file share. The wafer goes back to storage.

The measurement is declared done. The data hasn't been checked yet — only collected.

Today 03 · The wait

+1week

The lot moves on. Weeks pass.

Today 04 · The discovery

Model extraction opens the data. Half of it is garbage.

A bad probe contact. A noisy instrument. A sweep clipped at compliance. A probe card drifting across the wafer. Outliers nobody can explain.

Today 05 · The cost

The wafer is off the chuck. The material may be gone. The modeling schedule slips.

Bad data is found at the worst possible moment — downstream, when it's too late.

01 The usual suspects

Five ways a curve can lie.

Each one looks like data. Each one, found weeks later, costs a re-measure the wafer may no longer be there for. Here is what each looks like — and what an agent says the second the sweep finishes.

Curves on this page are generated by a physics model of a bulk MOSFET with the artifacts injected — the same model that drives the live wafer below. Illustrative, not customer data. The reasoning is computed from each curve, not written by hand.

02 Timing is the product

Move the moment of discovery.

The checks aren't new. Engineers already do them — by eye, weeks later, one file at a time. AutoMeasure runs them while the wafer is still under the probes, when a re-measure costs seconds instead of a slipped schedule.

  1. Sweep endswafer on the chuck
  2. Wafer unloadedback to storage
  3. Lot moves onweeks pass
  4. Model extractiondata opened at last
  5. Scheduleslips
Today bad data found here
AutoMeasure found here — with the reason

Found weeks later

  • Retrieve the wafer — if it still exists
  • Re-book the prober and the engineer
  • Re-measure, re-clean, re-extract
  • Everything downstream waits

Found on the chuck

  • Re-probe or re-sweep in seconds
  • Same wafer, same die, same setup
  • Reason written in device terms
  • Clean data leaves the prober
Instruments & probers · any vendor
Your lab & test software · unchanged
AutoMeasure · agent layer
Modeling · AutoPDK or your own flow
Fab boundary · on-premises
Plate II The stack, exploded.

03 How it fits

A layer, not a rip-and-replace.

  1. Your instruments and probers. Any vendor. Nothing changes.
  2. Your lab and test software keeps running the sweeps, exactly as it does today.
  3. AutoMeasure sits on top — agents that read every result the moment it's written.
  4. When a curve fails a check, they act through that same software: re-probe or re-sweep, within rules your engineers set.
  5. Checked, explained, traceable data flows on to modeling.
  6. All of it runs on-premises. The data never has to leave the fab.
Zero changes to lab softwareAny instrument · any proberOn-premises

04 What the agents do

Watch. Check. Explain. Re-measure. Record.

  1. i

    Watch

    Every curve, the moment it lands. Not a sample. Not at the end of the lot.

  2. ii

    Check

    Against device physics — thermal limits, monotonicity, leakage, series resistance — and against the neighboring devices on the same wafer.

  3. iii

    Explain

    Every flag carries its reason, in device terms. Not a red cell.

  4. iv

    Re-measure

    On the spot, while the wafer is still on the chuck — re-probe or re-sweep, within rules your engineers set.

  5. v

    Record

    Every measurement carries its checks, its re-measurements and its provenance.

A red cell tells you something is wrong. A reason tells you what to do.

What a limit check gives you
dieVth (V)SS (mV/dec)Ion (µA)status
What the agent gives you
die (9, 6) · Id–Vg · 25.0 °C · touchdown 0412

→ re-probed and re-swept Both attempts kept in the record

05 Live · simulated wafer

Run a wafer. Break it. Watch the agents work.

A physics model behind every device, nine real checks computed from every curve, real decisions. Inject a fault, click any die to measure it next — and when the agent escalates, you're the engineer.

die —
Wafer W07 · lot L26 · 300 mm · NMOS 10 / 0.18 µm chuck 25.0 °C touchdown 0000
  • not yet measured
  • clean
  • flagged
  • re-measured on the chuck
  • real outlier, kept
  • device failure

Click any die to measure it next

Inject on next die
Id–Vg · log
neighboring dies this sweep re-measure
Checks—
    Agent—

    Starting the wafer. Every curve is checked the moment it lands.

    Recordevery attempt kept
      Curves checked
      0
      Flags raised
      0
      Re-measured on the chuck
      0
      Escalated to you
      0
      Real outliers kept
      0
      Clean curves → modeling
      0

      Simulated 300 mm characterization wafer: bulk NMOS test structures with realistic die-to-die variation. Device physics, checks and decisions run live in this page; nothing is pre-recorded and nothing leaves your browser.

      06 Edge cases

      When the obvious answer is wrong.

      Catching bad data is the easy half. The hard half is not throwing away good data — and knowing when to stop and ask.

      07 Provenance

      Every curve arrives with its record.

      Checks, re-measurements and provenance travel with the data. It flows straight into modeling with nothing to clean by hand — and anyone, at any later stage, can see why each curve is there.

      • Nothing deleted. A failed attempt stays, linked to the one that replaced it.
      • Nothing silent. Every setting the agent touched is written down, with the rule that allowed it.
      • Nothing orphaned. Instrument channel, probe card, recipe, temperature log and agent version on every curve.
      REC · W07 · die (9, 6) · S04 clean → modeling
      Device
      NMOS · W/L 10 / 0.18 µm
      Sweep
      Id–Vg · Vd 50 mV · 91 points
      Chuck
      25.0 °C · settled
      Card
      card 3 · touchdowns since service 1,204
      1. attempt 1 · td 0412

        Flagged — probe contact. On-current 37% below 8 neighbors; subthreshold swing matched (80.7 vs 80.9 mV/dec). Series resistance at a probe contact, source or drain.

      2. action

        Re-probe and re-sweep. Rule: contact retry — set by your engineers. No limits changed.

      3. attempt 2 · td 0413

        9 / 9 checks passed. Vth within 0.2σ of neighbors. Attempt 1 retained and linked.

      channel 2recipe idvg-lin v14temp log ✓checks v3.2agent rules v7
      repeats with the card footprint → the card
      a ring across cards and lots → the process
      AutoPDK · refit the models
      AutoCD · re-verify the designs
      Plate III From one wafer to the production floor.

      08 Where it goes

      From the first curve to the production floor.

      1. 1

        Characterization

        Thousands of curves per wafer, checked live.

        Where every engagement starts
      2. 2

        Parametric test · WAT & PCM

        Wafer maps watched lot by lot. A parameter drifting out of its window is flagged with the exact devices and sites behind it.

        As the checks prove themselves
      3. 3

        Production test support

        Agents triage test data around the clock, separating a tester or probe-card issue from a real process shift — before anyone opens a ticket.

        As the checks prove themselves
      4. 4

        The closed loop

        A real process shift triggers a model refit in AutoPDK and re-verification of the affected designs in AutoCD.

        With AutoFab · AutoCD in development
      Change
      Measure · AutoMeasure
      Model · AutoPDK
      Verify · AutoCD
      Release
      Plate IV One data chain, from a process change to a signed-off release.

      09 One data chain

      Change. Measure. Model. Verify. Release.

      Today that loop takes a quarter, three teams and three toolsets, with files passed between them. With AutoFab it runs as one chain — in days, not a quarter.

      01 / 05

      Change

      10 AutoFab · the autonomous fab

      Three products. One data chain.

      Each stands on its own. Together they take a fab from the first touchdown on test silicon to a verified design — and back again every time the process moves.

      1. 01Crystal & wafer
      2. 02Process build
      3. 03Test silicon
      4. 04Characterize
      5. 05Model
      6. 06PDK release
      7. 07Design
      8. 08Production
      AutoMeasure AutoPDK AutoCD AutoMeasure · production test
      Early access · built with each fab

      AutoMeasure

      Autonomous measurement

      Agents on top of the lab you already run: every curve checked against physics and its neighbors, re-measured on the chuck, delivered with its provenance.

      40–70%
      less engineer time per measurement project, depending on complexity
      Zero
      changes to lab software
      See it run a wafer →
      Ready today

      AutoPDK

      Autonomous compact-model extraction & PDK release

      Your extraction method, run as a plan: decks generated, stages fitted in physics order against real SPICE, every stage checked — nothing fitted before an engineer says go.

      < 1 hour
      raw wafer data to a BSIM4 card · internal benchmark
      ≈ 11 weeks
      back on every PDK release
      34+
      compact models ready to run
      Open the AutoPDK tab →
      In development

      AutoCD

      Autonomous circuit design

      Circuits iterated across every corner, statistics in a virtual fab, DRC/LVS-clean layout verified post-layout — on the PDKs AutoPDK builds.

      60%+
      less designer time per chip · target
      2 blocks
      spec to verified layout on OpenPDK — an 8-bit SAR ADC and a 1 GS/s SiGe track-and-hold
      Open the AutoCD tab →

      11 Where the time goes

      What changes on every release.

      A process node goes round the loop many times before v1.0 — and again after every tweak. Here is one turn of it, today and with AutoFab.

      Today With AutoFab calendar time on the prober, unchanged — the solid part is engineer time
      01 month2 months3 months4 months5 months
      Characterizemeasurement, checks, clean-up
      ~8 weeks · bad data found weeks later
      same weeks on the prober · 40–70% less engineer time · bad data caught on the chuck
      Model & releaseextraction, QA, the kit
      2–3 months of expert extraction
      ≤ 1 week · AutoPDK
      Re-verify designsevery block, every corner
      by hand, every release
      re-run on the new models · AutoCD, in development
      Today, per PDK release~5 months
      With AutoPDK~2 months
      Back on every release≈ 11 weeks
      A process change, end to enddays, not a quarter

      Mature-node PDK release, as published for AutoPDK: the ~2 months is mostly the ~8 weeks of characterization, which stays on the prober. The AutoMeasure figure is engineer time per measurement project, 40–70% depending on complexity. “Days, not a quarter” is the loop after a process change, once checked data is flowing. Modeling figures from hands-on extraction work and AutoPDK's internal benchmark; the AutoCD figure is a target for a product in development.

      12 Conduct

      Triage. Explain. Escalate.

      Triage

      Every flag is sorted: the measurement, the setup, or the silicon. Each needs a different response, and a different person.

      Explain

      Every flag is explained in device terms, with the curve and the checks behind it — the passed ones as well as the failed ones.

      Escalate

      To the engineer, with the evidence attached, whenever a decision isn't the agent's to make. The run keeps going while it waits.

      And one rule above the rest: never silently change a limit.

      13 Honest status

      Not a download. Built with each fab.

      AutoMeasure is co-developed on your own instruments and your own data. It starts with your characterization flow and extends into parametric and production test as the checks prove themselves. It runs on-premises. It is not an off-the-shelf download, and we don't pretend it is.

      1. 01

        Start with characterization

        Your instruments, your probers, your software, your device types. We map the flow and the checks your engineers already trust before the agents touch anything.

      2. 02

        Co-develop the checks

        Physics and neighbor checks tuned to your devices. Re-measure and escalation rules set by your engineers, and no one else.

      3. 03

        Prove them, then extend

        Into WAT, PCM and production test, one stage at a time, as each check earns its place on real lots.

      4. 04

        Close the loop

        Connect clean, traceable data to AutoPDK for the refit — and to AutoCD for re-verification as it arrives.

      • On-premisesdata never has to leave the fab
      • Any vendorinstruments and probers you already own
      • Zero changesto the lab and test software you run
      • Early accessbuilt with each fab

      14 Questions engineers ask

      The hard questions, answered plainly.

      Do we have to change our lab or test software?

      No. AutoMeasure is a layer on top of what you already run. Your software keeps executing the sweeps; the agents read every result as it's written and act through that same software when a re-measure is needed. Zero changes to the existing setup.

      Which instruments and probers does it work with?

      Any vendor. Because it works through the lab and test software you already use, it isn't tied to a particular instrument, prober or tester.

      Does our data leave the fab?

      No. AutoMeasure runs on-premises. The data never has to leave the fab.

      What does "re-measure on the spot" mean in practice?

      A suspicious die is re-probed or re-swept immediately, while the wafer is still on the chuck — not discovered weeks later. What the agents may do on their own is set by your engineers, test by test. Every attempt is kept and linked in the record.

      Will the agents change our limits or recipes?

      Never silently. If a better range or limit would help — a sweep clipped at compliance, for example — the proposal goes to the engineer with the evidence attached, and nothing changes until they approve.

      Does it throw away outliers?

      No. An outlier is re-measured. If the answer holds, it's the device, not the measurement — kept, labeled and handed to modeling as a real outlier. Nothing is deleted; failed attempts stay linked to the ones that replaced them.

      What happens when the agent isn't sure?

      It escalates instead of guessing. The engineer gets the curve, the checks that failed, the checks that passed, and a plain statement of what the agent doesn't know. The rest of the wafer keeps running while it waits.

      What about destructive or stress measurements?

      A damaged device is a case for escalation, not a retry. When a sweep shows the device itself has failed — an oxide breakdown, for example — the agents stop stressing it, record it as a device failure and ask the engineer what to do next.

      How does it separate a tester problem from a process shift?

      By where the pattern lives. Failures that repeat with the probe-card footprint or follow probing order point at the setup; a signature that crosses cards, testers and lots points at the process. The triage comes with the maps and the devices behind it, before anyone opens a ticket.

      Is this an off-the-shelf product?

      No, and we don't pretend it is. AutoMeasure is built with each fab — co-developed on your instruments and data, starting with your characterization flow and extending into parametric and production test as the checks prove themselves.

      Do we need AutoPDK to use it?

      No. Clean, traceable data helps any modeling flow. Together with AutoPDK and AutoCD it closes the loop: a real process shift triggers a model refit and re-verification of the affected designs.

      How much engineer time does it save?

      40 to 70 percent less engineer time per measurement project, depending on complexity. The bigger effect is on the schedule: bad data stops surfacing weeks later, at extraction, when the wafer is gone.

      → Early access

      Bring us your characterization flow.

      AutoMeasure is in early access, built with each fab. Tell us about your devices, your instruments and how your test flow runs today — we'll show you where the agents would sit, and what they would check first.

      contact@autopdk.ai On-premises · any vendor · zero changes to lab software
      Next in the chain · 02 · Model AutoPDK The measured silicon becomes a model card — extracted in physics order, checked twice, released as the PDK.
      measured · ○
      model card · fitting
      Id over Vg × Vd · L 0.18 µm
      Plate I A transistor's whole I–V surface, and a model card fitting itself to the measured silicon.

      AutoPDK · Autonomous compact-model extraction and PDK release · Ready today

      Compact models, extracted autonomously.

      From measured wafer data to a PDK-ready model card in under an hour. Real physics, real SPICE — the AI does the orchestration, your engineers make the decisions.

      ExtractionRMS —
      Id–Vg · log · 4 geometriesmeasured model
      Stage chart
      1. C–V
      2. Threshold
      3. Mobility
      4. Geometry
      5. Series R
      6. Output
      7. Temperature
      Plan approved · fitting in physics order
      • < 1 hourraw wafer data to a finished BSIM4 card · internal benchmark
      • 60–75%less engineer time per model, including review and sign-off
      • 0netlists written by hand — every simulation deck generated
      • 34+compact models ready to run, any Verilog-A model on request

      Today 01 · Where the months go

      Years to build a process. Then every chip waits here.

      Characterize: thousands of curves, about eight weeks. Model: dozens of devices, hundreds of parameters, two to three months. Release: corners, statistics, QA, versions. No PDK, no customers.

      Today 02 · The loop

      It loops. Every release.

      v0.1 on first silicon. v0.5 when the process is tuned: refit everything. v0.9: refit again, add statistics. v1.0 — and every tweak after that. One node, five releases, and today each one is a quarter of work.

      Today 03 · The bottleneck

      The method lives in one engineer's head — and four hundred lines of macro.

      Which device first, which parameters, which bounds, in what order. When that expert is busy, the release waits — and every chip on the node waits with it.

      By hand · Id–Vg linear · L 0.25 / 0.18 µmattempt 1

      AutoPDK 04 · The method becomes the asset

      Described once, in plain language. Executed on every technology.

      Decks generated, stages fitted in physics order against real SPICE, every stage checked — and nothing fitted before an engineer says go.

      1. 01 · C–V
      2. 02 · Threshold
      3. 03 · Mobility
      4. 04 · Vth roll-off
      5. 05 · Series R
      6. 06 · Output
      7. 07 · Temperature
      01 · C–V · Cox, flat-band
      02 · Threshold & swing · Vth, n, µ0
      03 · Mobility · µ0, θ
      04 · Geometry · roll-off with L
      05 · Series Resistance · Rs
      06 · Output · DIBL, CLM, vsat
      07 · Temperature · kVt, µ(T)
      independent verifier · second model
      Plate II The extraction plan, as a ladder: each rung fitted only when the one below is accepted.

      02 How it works

      Your method in. A signed-off card out.

      1. Drop in the data. Measurement files land; AutoPDK surveys the devices, geometries, temperatures and C–V on its own.
      2. Get a plan. Your extraction method — or ours — becomes a stage-by-stage plan with parameters and bounds. Nothing is fitted until you say go.
      3. Fit in physics order. C–V, threshold, mobility, output, scaling, temperature — each stage fitted against real SPICE and scored before it is accepted.
      4. Checked twice. An independent verifier on a second model re-checks every stage. If they disagree, the stage stays red until it is resolved.
      5. Locked, not re-litigated. An accepted stage is locked; later stages can't quietly undo it. Lock, re-run or override any stage yourself.
      6. Verify and report. Overlays on every device, an independent check, and a sign-off report in your own template.
      01 C–V · gateCox and flat-band from accumulation planned

      measured starting card model, fitting

      Real SPICE, not a surrogatePlan first, then fitEvery stage scored

      03 Live · in your browser

      Read the plan. Say go. Watch it fit in physics order.

      A real fit, running right here: four device geometries, two temperatures, Id–Vg, Id–Vd and C–V — 645 measured points, seven stages in physics order. Choose how much autonomy to hand over, then press go — or take the wheel yourself.

      Dataset — model demo compact model · 14 parameters RMS —
      Id–Vg · log · Vd 50 mV · L 10 / 0.5 / 0.25 / 0.18 µm
      Id–Vg · linear · Vd 50 mV · short channels
      Id–Vd · L 0.18 µm
      C–V · gate
      Vth vs L · roll-off · constant current
      Id–Vg · log · L 10 µm · 25 and 125 °C
      measured model, fitting model, accepted starting card
      Parametersstarting card
      Independent checkwaiting

      Every stage is re-simulated independently from the card before it turns ink; the final check uses data the fit never saw.

      The engine runs the whole plan, scores every stage and stops only if the verifier disagrees.

      Convergencestage RMS by iteration
      Plan7 stages · nothing fitted yet

        In-browser demonstration: a simplified compact model (14 parameters) fitted by Levenberg–Marquardt to synthetic measurements with noise. AutoPDK itself fits full CMC models — BSIM4, PSP, BSIM-CMG, HICUM and more — against real SPICE, on your data, with your method.

        04 The record run · internal benchmark

        A BSIM4 card in under one hour.

        A full production-style dataset — every geometry corner, three temperatures, body bias and C–V — taken from raw wafer data to a verified, sign-off-ready BSIM4 card, fully autonomously. The same flow usually books days of an expert's calendar.

        00:00h:mm
        1. 00:00

          Data drop

          The engine surveys corners, temperatures and coverage on its own.

        2. 00:02

          Decks + plan

          Every simulation deck generated; a corners-first plan.

        3. 00:05

          Autonomous fitting

          Stage by stage against true SPICE, each scored before it is accepted.

        4. 00:50

          Verification

          Overlays across every corner, plus an independent check.

        5. < 1:00

          Card + report

          Finished model card with lineage, and a sign-off report.

        Overlays · every cornerwaiting for data

          Illustrative: the in-browser demo device, its card converging stage by stage and then checked device by device — Id–Vg at Vd 50 mV and 1.8 V. The record run itself used a full production dataset.

          05 The autonomy dial

          Three levels of autonomy. One engine.

          The same engine drives all three — hand it the keys, gate every step, or take the wheel yourself. Switch at any time, mid-extraction.

          Autonomous

          The AI does the modeling.

          Drop in measurements. The engine surveys the data, generates the decks, builds a corners-first extraction plan, fits stage by stage, self-verifies against quality gates and publishes the report.

          All seven stages converging · RMS by iteration
          • Physics-ordered workflow: C–V → room-temperature DC by effect → geometry scaling → temperature
          • Every stage scored and accepted or retried — nothing silently passes
          • An independent verifier on a second model cross-checks results

          Gated

          The AI drives. You approve.

          Plan-first by design: every stage — devices, diagrams, parameters, bounds — is proposed, and nothing fits until you say go. Intervene anywhere, then let it continue.

          Stage 2 fitted · waiting for your accept
          • Chat-native: “plan a full extraction, don't fit until I say go”
          • Review stages in the extraction cockpit before and after any run
          • Disagreements between the AI and the verifier stay red until resolved

          Hands-on

          You drive. The AI assists.

          Don't want AI making modeling decisions? Use it as the fastest operator you've ever had: it does the chores — setup, netlists, simulations, plots, reports — and touches nothing you didn't ask for.

          Cross-measurement diagram · Vth vs L, your card (dashed) and the fit
          • Full manual cockpit: stage-based fitting, overlays, direct parameter control
          • Cross-measurement diagrams: Vth vs L, gm,max vs T, custom expressions
          • Model cards versioned with full lineage — every change traceable

          06 What makes it different

          Everything an extraction needs. Nothing to script.

          i

          Netlists written for you

          Every deck — DC and C–V, every device, bias and temperature — generated from your measurements: instance line, sources, sweeps, temperature, model loading, convergence aids. You never author a test setup.

          ii

          Your methodology

          Describe your extraction flow once, in plain language. It becomes a plan the engine follows on every new technology — your playbook, not ours, unless you want ours.

          iii

          Any standard model

          34+ compact models ready to run, compiled to native code from the Verilog-A your PDK already ships — and any other Verilog-A model on request. One engine for all of them.

          iv

          Surgical library updates

          Point it at a full PDK library; only the model that needs re-extraction changes. Everything else stays byte for byte.

          v

          Reports in your format

          Drop in last year's report or describe what you want — every run produces a sign-off report in that template, with live charts grounded in the actual simulations.

          vi

          Accountable by design

          Every card versioned with full lineage. An independent check must agree, or the stage stays red. Runs on-premises or in the cloud.

          07 Model library

          If it's Verilog-A, it runs here.

          Compiled and simulated natively in true SPICE — the exact model code your PDK ships. 34+ industry standards come precompiled; adding another is a drop-in, not a product release you wait for. Your golden simulator is integrated on request, so the card you sign off is verified where you actually simulate.

          BSIM4BSIM-BULKBSIM6BSIMSOIHiSIM-SOIL-UTSOIBSIM-CMGBSIM-IMGPSP 103HiSIM2
          HICUM/L2HICUM/L0MEXTRAMVBICDIODE_CMCJUNCAPR2_CMCR3_CMCMOSVAR
          ASM-HEMTMVSG_CMCIGBT+ any Verilog-A modelBSIM4PSP 103BSIM-CMGHICUM/L2
          MOSFET
          bulk, SOI and FinFET · output family
          BJT · HBT
          including SiGe · Gummel plot
          Diode · passives · varactor
          junctions, resistors, MOS varactors · C–V
          HEMT · power
          GaN, SiC and power devices · self-heating

          Characteristic curves sketched for each device family — illustrative shapes, not fitted data.

          08 Reports

          Reports in your format, not ours.

          Every extraction produces sign-off reports with live charts — grounded in the actual simulation data, and blunt about what isn't good enough yet. A bad starting card is called a bad starting card; a fit that regressed a metric is shown, not smoothed over.

          Before you start

          Initial assessment

          Data readiness · corners · C–V
          ready
          Starting card vs measured
          fail — extraction needed
          Dominant defect
          identified & explained
          Recommended workflow
          C–V → threshold → … → temperature

          Starting card (dashed) against measured points — before any fitting.

          When it's done

          Final extraction report

          Accuracy vs starting card
          improved — every metric
          Before / after overlays
          all corner devices
          Stages
          7 / 7 accepted
          Verdict
          sign-off ready

          The same devices after the plan — from the in-browser fit above.

          09 WAT / PCM analysis

          Folder in. Insight out.

          Parametric test data usually dies in spreadsheets. Drop a folder of WAT/PCM exports on AutoPDK — as they come from the tester, mixed lots and all — and get wafer maps, parameter trends and lot-to-lot comparisons immediately. Then ask for any plot you can describe.

          ›
          Median edge-site Vth per wafer · window ±30 mV

          No format wrangling

          Tester exports parsed as-is, grouped by lot, wafer, site and parameter — mixed lots, split files and inconsistent naming untangled.

          Any plot you can say

          That sentence is the plot spec: wafer maps, box plots, drift charts and site drill-downs — interactively or through the API.

          Next to the models

          PCM statistics live beside your compact models — one platform for watching the process and modeling the devices.

          10 Deployment & AI

          It goes to the data. Not the other way round.

          Measurement data is fab-confidential. AutoPDK runs where your data lives — and the intelligence layer is yours to choose.

          Cloud API

          Hosted AutoPDK with everything included. Push measurements over a REST API, stream extraction progress live, pull model cards and reports.

          • Fastest path from data to model card
          • Live progress events for your own dashboards
          • Per-project isolation

          Private deployment

          The entire platform — extraction engine, SPICE farm, assistant, database — ships as containers and runs on your hardware, inside your network.

          • Measurement data never leaves your site
          • Air-gapped if required
          • Same API and UI as the cloud

          Bring your own AI

          Our hosted models, your enterprise AI gateway, or a fully local model — and two together: one drives the extraction while a second independently verifies it.

          # your local AI
          MODEL_BASE_URL=http://127.0.0.1:8000/v1
          # your gateway
          MODEL_BASE_URL=https://your-gateway/v1

          Agent-native by design: the whole platform is exposed as tools, so your own agents, scripts and design flows can drive extractions, simulations and reports programmatically.

          11 Where AutoPDK goes next

          Beyond the nominal card. Statistics and reliability.

          A production PDK is more than one typical model. The next versions carry the same autonomous, physics-driven extraction into the corners, the statistics and the aging a design team signs off against.

          1. Next version

            Statistical modeling & Monte Carlo

            Corner cards from measured spread; local and global variation extracted from wafer and lot data into a Monte Carlo-ready model — mismatch, process and temperature — with the same stage-by-stage checks.

          2. Following version

            Reliability modeling

            Aging extracted from stress measurements — bias-temperature instability, hot-carrier degradation, time-dependent dielectric breakdown — as reliability models and aging-aware corners.

          3. Planned

            RF & S-parameter fitting

            Measured S-parameters fitted against the same compact models, extending the kit to RF and high-speed devices without a second toolset.

          Roadmap items are in development; AutoPDK's nominal extraction, library updates and reports are available today. Roadmap plots are illustrative.

          12 What it gives back

          Months of modeling. One week.

          ≈ 11 weeks

          back on every PDK release — about five months becomes about two, with characterization unchanged.

          ≤ 1 week

          of modeling per release, down from two to three months of expert extraction.

          1 engineer

          where modeling often took several — reviewing and deciding, not scripting.

          Today, per PDK release
          characterize · 8 weeksmodeling & release · 2–3 months
          ~5 months
          With AutoPDK
          characterize · 8 weeks
          ~2 months

          The method stays yours. The months come back.

          Mature-node PDK release. Modeling times from hands-on extraction experience; characterization time unchanged. “Under an hour per card” is AutoPDK's internal benchmark.

          13 Who it is for

          Built for the teams that ship process design kits.

          01

          New fabs coming online

          A first PDK, then a release every few weeks while the process settles — without a modeling department to match.

          02

          Foundries launching nodes

          Every node loops measure → model → release many times before v1.0. Each loop gets shorter.

          03

          Specialty fabs

          GaN, SiC, RF and power processes with their own compact models — any standard model, one engine.

          04

          Fabless design teams

          Models you can trust for your corners, and designs re-verified the moment the PDK moves.

          → Ready today · early access open

          See AutoPDK on your own data.

          Early-access teams get a working instance — on our cloud or on your hardware — and an engineer who runs the first extraction with them. Bring your data and your methodology; send the report template your QA already accepts.

          contact@autopdk.ai Any standard model · your method · cloud or on-premises
          Next in the chain · 03 · Verify AutoCD The circuits built on these models — iterated across every corner, laid out, verified, and re-verified every time the PDK moves.
          capacitor array · 256 unit capacitors
          comparator · mirror-symmetric
          SAR logic
          metal 1
          top-plate routing
          extracted parasitics
          by hand · one block at a time
          PDK v0.9 · 40 blocks to re-verify
          Plate I An 8-bit SAR ADC, rendered from its own layout database. Generated, placed, routed and verified by the flow.

          AutoCD · Autonomous circuit design · In development

          Spec in. Verified layout out.

          AutoCD iterates the circuit, simulates every corner, runs the statistics in a virtual fab and finalizes schematic and layout — DRC- and LVS-clean, verified after layout — on the PDKs AutoPDK builds. The designer sets the spec and signs off.

          Sign-off · post-layoutOpenPDK
          DRC
          0 errors
          LVS
          clean match
          ENOB
          7.85 bit
          DNL / INL
          ±0.38 LSB
          8-bit SAR ADC · 500 kS/s · 1.8 V
          • 60%+less designer time per chip · target, with minimal intervention
          • All cornerssimulated in a virtual environment, plus Monte Carlo before tape-out
          • DRC · LVS · PEXreal sign-off decks in the loop — layout verified, not drawn and hoped
          • 2 blocksspec to verified layout on OpenPDK

          Today 01 · The PDK moved

          The PDK just moved from v0.5 to v0.9. Forty blocks are built on it.

          Every one of them has to be re-simulated at every corner. Some have to be re-laid-out. Who does it — and how long does the tape-out wait?

          Today 02 · The hand work

          Months, lost to the same work again.

          Corners, statistics, layout, parasitics, sign-off — repeated by hand on blocks that worked last release, every time the process moves.

          AutoCD 03 · The loop as a flow

          Layout is verified, not drawn and hoped.

          Generated layout, DRC- and LVS-clean, symmetry where the circuit needs it — and the extracted parasitics go straight back into simulation.

          AutoCD 04 · The designer decides

          The designer sets the spec. AutoCD does the iteration.

          It stops for approval wherever the designer wants one — and it does not take the decision.

          01 · Iterate circuit
          02 · All corners
          03 · Statistics
          04 · Schematic & layout
          05 · Post-layout
          06 · Tape-out & test
          Plate II The flow, station by station — on real simulators and real sign-off decks.

          02 The flow

          Every corner, every PDK update — without the hand work.

          1. Iterate the circuit. Topology and sizing from the spec, refined against simulation — not guessed.
          2. Simulate all corners. Process, voltage and temperature — every corner, every time the PDK changes.
          3. Run the statistics. Monte Carlo in a virtual fab before tape-out — mismatch and process spread, not only typical.
          4. Schematic and layout. Generated layout, DRC- and LVS-clean, symmetry where the circuit needs it.
          5. Post-layout sign-off. Extracted parasitics back into simulation; the same measurements as before layout.
          6. Tape-out and test. Silicon that matches simulation is production grade. The designer signs off.
          Real simulatorsReal sign-off decksDesigner approval gates

          03 Live · a new PDK lands

          A new model card arrives. Watch the block re-verify.

          A model card is a trigger, not a project. Release a new PDK version to the 1 GS/s track-and-hold below: all 27 process, voltage and temperature corners re-simulate, the ones that slip are flagged, the block is re-tuned and re-verified — and the designer signs off.

          worst corner
          process SS → FF
          supply −10% → +10%
          −40 → 125 °C
          Block 1 GS/s track-and-hold · OpenPDK SiGe BiCMOS PDK v0.5 spec SFDR ≥ 60 dB at Nyquist
          • corner meets spec
          • re-simulating
          • below spec
          SFDR by corner27 / 27 meet spec
          Flowidle
          1. New model card received from AutoPDK
          2. Re-simulate 27 PVT corners
          3. Flag corners below spec
          4. Re-tune the circuit against the new models
          5. Re-verify all corners
          6. Monte Carlo · 500 runs
          7. Layout patch · DRC · LVS · PEX
          8. Designer sign-off
          AutoCD—

          On PDK v0.5 the block meets spec at all 27 corners. Release a new PDK version to see what happens when the models move.

          Corners
          27
          Worst-case SFDR
          —
          Monte Carlo yield
          —
          Designer decisions
          0

          Illustrative: a behavioral model of the published 1 GS/s track-and-hold across corners, with a hypothetical model update. The real flow runs real simulators and sign-off decks on the actual netlist and layout. The published block meets ≥ 60 dB SFDR at all 27 corners.

          04 Chips it has built

          Two blocks, two OpenPDKs. Spec to verified layout.

          To prove the flow end to end, two classic mixed-signal blocks went all the way from specification to a DRC- and LVS-clean layout, then were re-simulated with the extracted parasitics. The figures are post-layout results, not schematic estimates.

          Chip 1 · OpenPDK · CMOS

          8-bit SAR ADC, 500 kS/s

          Capacitive DAC, dynamic comparator and SAR logic, generated, placed, routed and verified as one block at 1.8 V.

          DRC errors
          0
          LVS
          clean match
          ENOB, post-layout
          7.85 bit
          DNL / INL within
          ±0.38 LSB
          Power
          17 µW
          Area
          0.063 mm²
          Post-layout spectrum with full-chip parasitics: SNDR 49.0 dB, ENOB 7.85 bit.
          Post-layout linearity: every code within ±0.5 LSB.
          • Capacitor array. 256 unit capacitors, with the top-plate routing that sets the LSB accuracy.
          • Comparator, placed with mirror symmetry. Asymmetric routing had cost 7 mV of offset; symmetry cut it to 1–2 mV.

          Chip 2 · OpenPDK · SiGe BiCMOS

          1 GS/s track-and-hold

          A bipolar front end for high-speed data converters, verified with the PDK's own sign-off decks and checked across 27 process, voltage and temperature corners.

          DRC errors
          0
          LVS
          clean match
          SFDR at Nyquist
          80.9 dB
          SFDR, all 27 corners
          ≥ 60 dB
          ENOB, post-layout
          8.6 bit
          Bandwidth
          12 GHz
          Post-layout, 492 MHz input at 1 GS/s: SFDR 80.9 dB, THD −79.6 dB.
          Track bandwidth, schematic vs post-layout — the parasitics are in the answer, not left for later.
          • Front end. SiGe transistors along the front, hold capacitors and thick top metal above.
          • Hold capacitors. MIM capacitors on the thick top metal, with via stacks down to the transistors.

          Both blocks were designed with the AutoCD flow on publicly available OpenPDKs; typical-corner figures unless stated. They demonstrate the flow; they are not taped-out products. The spectra and linearity plots on this page are rendered from behavioral models tuned to the published post-layout results.

          05 Built on AutoPDK

          The design is only as good as the model under it.

          AutoCD runs on the PDKs AutoPDK generates. When the process moves, AutoPDK refits the models and AutoCD re-verifies every design against them — the same data chain, from test silicon to a verified circuit.

          01

          One source of truth

          Models, corners and statistics come straight from the PDK release — no copy that drifts out of date between the modeling team and the design team.

          02

          Re-verify on every release

          A new model card is a trigger, not a project: the affected blocks are re-simulated across corners and flagged if they no longer meet spec.

          03

          Designer in control

          The engineer sets the spec, approves each step if they wish, and signs off. AutoCD does the iteration; it does not take the decision.

          04

          The whole chain

          Change → Measure → Model → Verify → Release: AutoMeasure, AutoPDK and AutoCD as one loop that runs in days, not a quarter.

          06 Honest status

          In development. Available after AutoPDK.

          Ready today

          AutoPDK — autonomous extraction and PDK release, the foundation AutoCD stands on.

          In development

          AutoCD, with production-grade release targeted in the next 9–15 months. The flow has been proven end to end on two blocks on OpenPDK.

          Shape it with us

          Design teams who want AutoCD on their process can talk to us now — and decide what it does first.

          The designer sets the spec and signs off. AutoCD does the iteration.

          → In development · shape it with us

          Want AutoCD on your process?

          Tell us the blocks you re-verify on every PDK update. We'll show you the flow on OpenPDK — and talk about yours.

          contact@autopdk.ai Real simulators · real sign-off decks · designer in control
          Back to the start of the chain · 01 · Measure AutoMeasure Change → Measure → Model → Verify → Release. One data chain — in days, not a quarter.